Working Toward More Resilient Wafer Fabrication (.PDF Download)

In a new report on Emerging Resilience in the Semiconductor Supply Chain, the Semiconductor Industry Association (SIA) and Boston Consulting Group foreshadow a time in the near future when wafer fabrication becomes more resilient. They say that by 2032, leading-edge wafer fabrication capacity will diversify beyond Taiwan and South Korea to include the U.S., Europe and Japan.