Mouser Electronics has collaborated with National Instruments to offer a free edition of NI’s MultiSIM Blue, a tool that adds features and functionality to offer engineers a SPICE simulation environment of electronic circuits using Mouser’s offering of electronic components. The tool will be available in September.
MultiSIM BLUE includes more than 100,000 electronic components with simulation features and SPICE (Simulation Program with Integrated Circuit Emphasis) analyses. It lets engineers visualize and assess linear performance, making design faster and more productive. The tool also allows users to create schematics, simulate circuits, and build printed circuit board (PCB) layouts. MultiSIM BLUE features an interactive schematic interface with a full-right-click menu and supports many component types, including passives, sensors, discretes, and more.
Mouser and National Instruments announced the launch of the tool in conjunction with National Instruments’ NIWeek conference, held August 4-7 in Austin, Texas. Mouser was a sponsor and keynote speaker during the event, detailing the upcoming release of MultiSIMBlue, also referred to as the MultiSIM Component Evaluator, Mouser Edition.
“We are excited to be partnering with National Instruments on this new design tool for engineers. Providing our customers with the newest, authorized electronic components never has been enough for us,” Kevin Hess, Mouser’s vice president of technical marketing, said in a statement announcing the upcoming launch. “… With MultiSIM BLUE, Mouser and NI, two giants in the industry, have partnered to set a new standard in creating an easy-to-use, integrated platform for circuit simulation and design to PCB to BOM.”
“NI has been providing design engineers with tools to optimize their design performance and reduce time to market for years,” added Ray Almgren, NI’s vice president of marketing. “We’re excited to partner with Mouser to extend the reach of our powerful design tools with MultiSIM BLUE and provide every circuit designer with the latest components in the market.”
